MC68M360ZP25VLR2
NXP USA Inc.
MC68M360ZP25VLR2
NXP USA Inc.
IC MPU M683XX 25MHZ 357BGA
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Product details
The MC68M360ZP25VLR2 from NXP USA Inc. delivers automotive-grade performance in the Embedded - Microprocessors segment, developed for next-generation vehicle electronics. This AEC-Q100 qualified microprocessor combines functional safety features with high computational density, meeting stringent automotive reliability requirements.Based on the CPU32+ architecture, the processor delivers ASIL-D compliant performance for safety-critical automotive applications.The 1 Core, 32-Bit configuration provides redundant processing paths required for fault-tolerant automotive systems.With operating speeds up to 25MHz, the device meets the real-time requirements of advanced driver assistance systems (ADAS).The Communications; CPM units accelerate sensor fusion algorithms required for autonomous driving systems.Automotive-grade DRAM memory interfaces include ECC protection for enhanced data reliability in safety-critical systems.No graphics support enables rendering of high-resolution instrument clusters and head-up displays.10Mbps (1) implementations provide the backbone for automotive Ethernet networks supporting time-sensitive applications.3.3V tolerant I/Os ensure reliable operation across the automotive voltage range.Qualified for 0°C ~ 70°C (TA) operation, the processor functions reliably in extreme automotive environments.The 357-BGA package meets automotive reliability standards for thermal cycling and mechanical stress.Available in 357-PBGA (25x25), the device supports automotive PCB assembly processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: CPU32+
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 25MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10Mbps (1)
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 70°C (TA)
- Security Features: -
- Package / Case: 357-BGA
- Supplier Device Package: 357-PBGA (25x25)
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