MCF54453VR266
NXP USA Inc.
MCF54453VR266
NXP USA Inc.
IC MCU 32BIT ROMLESS 360TEPBGA
Reference Price (USD)
1+
$33.00000
500+
$32.67
1000+
$32.34
1500+
$32.01
2000+
$31.68
2500+
$31.35
Exquisite packaging
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MCF54453VR266
$33.00
Product details
The MCF54453VR266 by NXP USA Inc. is a breakthrough in Embedded - Microcontrollers, specifically designed for renewable energy systems. Its advanced power management architecture and grid synchronization capabilities make it perfect for solar inverters and wind turbine controllers.Featuring Coldfire V4 technology, this microcontroller executes complex MPPT algorithms in real-time while maintaining less than 2% THD in power conversion applications.The 32-Bit Single-Core processing architecture enables simultaneous voltage and current waveform analysis, crucial for three-phase grid-tied inverters requiring precise harmonic compensation.Operating at 266MHz, the device performs 64-point FFT calculations within 50 s, enabling rapid detection of grid anomalies in distributed generation systems.I²C, SPI, SSI, UART/USART, USB OTG interfaces support Power Line Communication protocols, allowing direct data transmission over existing AC wiring in smart metering applications.Integrated DMA, WDT include dedicated PWM timers with dead-band control for driving IGBT modules in high-efficiency power conversion stages.With 132 optically isolated inputs, the microcontroller can directly interface with high-voltage sensing circuits in utility-scale power equipment.The ROMless implementation features shadow memory for fail-safe firmware updates during continuous operation of critical power infrastructure.32K x 8 of battery-backed RAM maintains system state during brief grid outages, ensuring seamless re-synchronization when power returns.The 1.35V ~ 3.6V range supports direct operation from PV strings up to 1000V DC through integrated buck converters.The Internal maintains 0.01% frequency stability for accurate phasor measurement in smart grid synchronization applications.Rated for 0°C ~ 70°C (TA), the device operates reliably in solar farm environments where module temperatures can exceed 85 C.Surface Mount packaging withstands high humidity and salt spray conditions encountered in coastal wind power installations.The 360-BBGA provides 5kV isolation between high-voltage and control circuits, meeting UL 1741 safety requirements.Available in 360-TEPBGA (23x23), the microcontroller undergoes rigorous testing for electromagnetic compatibility in high-noise power environments.
Product Attributes
- Product Status: Obsolete
- Core Processor: Coldfire V4
- Core Size: 32-Bit Single-Core
- Speed: 266MHz
- Connectivity: I²C, SPI, SSI, UART/USART, USB OTG
- Peripherals: DMA, WDT
- Number of I/O: 132
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 32K x 8
- Voltage - Supply (Vcc/Vdd): 1.35V ~ 3.6V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 360-BBGA
- Supplier Device Package: 360-TEPBGA (23x23)
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