MCIMX512DJM8C
NXP USA Inc.
MCIMX512DJM8C
NXP USA Inc.
IC MPU I.MX51 800MHZ 529BGA
Reference Price (USD)
1+
$65.22000
500+
$64.5678
1000+
$63.9156
1500+
$63.2634
2000+
$62.6112
2500+
$61.959
Exquisite packaging
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MCIMX512DJM8C
$65.22
Product details
NXP USA Inc.'s MCIMX512DJM8C revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The ARM® Cortex®-A8 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 800MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.The Multimedia; NEON™ SIMD units accelerate OFDM processing and channel coding algorithms.High-bandwidth LPDDR, DDR2 memory interfaces support the massive data flows characteristic of 5G signal processing.No graphics capabilities enable visualization of network performance metrics in real-time.The Keypad, LCD interfaces support remote management consoles for network equipment.10/100Mbps (1) implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.USB 2.0 (3), USB 2.0 + PHY (1) interfaces enable flexible configuration and debugging of network equipment during deployment.1.2V, 1.875V, 2.775V, 3.0V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for -20°C ~ 85°C (TC) operation, the processor maintains performance in outdoor radio unit installations.Carrier-grade ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC protect network infrastructure from both physical and cyber threats.The 529-LFBGA package design optimizes thermal performance for continuous high-load operation.Available in 529-BGA (19x19), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A8
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 2.0 (3), USB 2.0 + PHY (1)
- Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
- Operating Temperature: -20°C ~ 85°C (TC)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
- Package / Case: 529-LFBGA
- Supplier Device Package: 529-BGA (19x19)
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