MCIMX515DJZK8C
NXP USA Inc.
MCIMX515DJZK8C
NXP USA Inc.
IC MPU I.MX51 800MHZ 529BGA
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Product details
The MCIMX515DJZK8C by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A8 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 800MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Multimedia; NEON™ SIMD neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The LPDDR, DDR2 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.Yes GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting Keypad, LCD outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.10/100Mbps (1) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 (3), USB 2.0 + PHY (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.2V, 1.875V, 2.775V, 3.0V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -20°C ~ 85°C (TC) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC include model encryption and secure model update mechanisms for protected edge AI deployments.The 527-TFBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 527-BGA (13x13), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM® Cortex®-A8
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR, DDR2
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 2.0 (3), USB 2.0 + PHY (1)
- Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
- Operating Temperature: -20°C ~ 85°C (TC)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
- Package / Case: 527-TFBGA
- Supplier Device Package: 527-BGA (13x13)
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