MCIMX6D5EZK08AE
NXP USA Inc.
MCIMX6D5EZK08AE
NXP USA Inc.
I.MX6D POP ARIK-D POP RO
Reference Price (USD)
1+
$78.03280
500+
$77.252472
1000+
$76.472144
1500+
$75.691816
2000+
$74.911488
2500+
$74.13116
Exquisite packaging
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MCIMX6D5EZK08AE
$78.03
Product details
NXP USA Inc.'s MCIMX6D5EZK08AE sets new benchmarks in the Embedded - Microprocessors market segment, optimized for compute-intensive embedded applications. This system-on-chip solution integrates advanced processing cores with sophisticated power management, delivering exceptional performance-per-watt characteristics for energy-conscious designs.The ARM® Cortex®-A9 architecture provides deterministic execution of real-time tasks while maintaining low power consumption, making it particularly suitable for battery-powered edge computing devices.Architected with 2 Core, 32-Bit capability, the processor enables efficient task partitioning and memory bandwidth utilization in multi-threaded applications.With clock speeds up to 800MHz, the device meets the computational demands of advanced motor control algorithms and power conversion systems.The Multimedia; NEON™ SIMD acceleration units significantly enhance performance for matrix operations common in AI inference tasks.Support for LPDDR2, LVDDR3, DDR3 memory technologies allows designers to optimize system cost and performance for specific application requirements.The Yes graphics subsystem enables smooth rendering of complex graphical user interfaces without external GPU components.Integrated Keypad, LCD interfaces support direct connection to modern display technologies, reducing BOM costs in HMI applications.10/100/1000Mbps (1) connectivity options provide the necessary bandwidth for industrial communication protocols including EtherCAT and PROFINET.SATA 3Gbps (1) implementations provide reliable mass storage connectivity for data acquisition systems requiring high-capacity local storage.USB 2.0 + PHY (4) implementations adhere to the latest USB standards, ensuring backward compatibility while supporting high-speed data transfers.The 1.8V, 2.5V, 2.8V, 3.3V I/O banks offer design flexibility for interfacing with various peripheral devices in industrial control systems.Qualified for -20°C ~ 105°C (TJ) operation, the processor reliably functions in outdoor telecommunications equipment and base station applications.Comprehensive ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection protect against both physical and network-based attacks, crucial for financial terminals and secure access systems.The 569-LFBGA package design incorporates advanced thermal management features for reliable operation in confined spaces.Offered in 569-MAPBGA (12x12), the device supports both conventional and advanced PCB assembly techniques.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000Mbps (1)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 + PHY (4)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -20°C ~ 105°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 569-LFBGA
- Supplier Device Package: 569-MAPBGA (12x12)
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