MCIMX6DP6AVT1AB
NXP USA Inc.
MCIMX6DP6AVT1AB
NXP USA Inc.
IC MPU I.MX6DP ENHAN 624FCBGA
Reference Price (USD)
1+
$117.48000
500+
$116.3052
1000+
$115.1304
1500+
$113.9556
2000+
$112.7808
2500+
$111.606
Exquisite packaging
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MCIMX6DP6AVT1AB
$117.48
Product details
NXP USA Inc.'s MCIMX6DP6AVT1AB revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The ARM® Cortex®-A9 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 2 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 1.0GHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.The Multimedia; NEON™ SIMD units accelerate OFDM processing and channel coding algorithms.High-bandwidth LPDDR2, DDR3L, DDR3 memory interfaces support the massive data flows characteristic of 5G signal processing.Yes graphics capabilities enable visualization of network performance metrics in real-time.The HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel interfaces support remote management consoles for network equipment.10/100/1000Mbps (1) implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.SATA 3Gbps (1) interfaces provide local storage for network configuration and performance logging.USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) interfaces enable flexible configuration and debugging of network equipment during deployment.1.8V, 2.5V, 2.8V, 3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for -40°C ~ 125°C (TJ) operation, the processor maintains performance in outdoor radio unit installations.Carrier-grade ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS protect network infrastructure from both physical and cyber threats.The 624-FBGA, FCBGA package design optimizes thermal performance for continuous high-load operation.Available in 624-FCBGA (21x21), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, DDR3L, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
- Ethernet: 10/100/1000Mbps (1)
- SATA: SATA 3Gbps (1)
- USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
- Package / Case: 624-FBGA, FCBGA
- Supplier Device Package: 624-FCBGA (21x21)
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