MCIMX6L2DVN10AC
NXP USA Inc.
MCIMX6L2DVN10AC
NXP USA Inc.
I.MX 6SL ROM PERF ENHAN
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$25.05200
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$24.80148
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$24.55096
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$24.30044
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$24.04992
2500+
$23.7994
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Product details
NXP USA Inc.'s MCIMX6L2DVN10AC redefines power efficiency in the Embedded - Microprocessors segment, crafted for energy-harvesting IoT endpoints. This ultra-low-power microprocessor combines near-threshold voltage operation with intelligent power gating, achieving microampere-level standby currents for decade-long battery life in wireless sensor nodes.The ARM® Cortex®-A9 ultra-low-power core maintains full register retention at subthreshold voltages, enabling seamless operation from energy harvesting sources.Designed with 1 Core, 32-Bit configuration, the processor optimizes power distribution across multiple low-power domains.Operating at 1.0GHz in burst modes, the device balances performance and power consumption for intermittent computing applications.The Multimedia; NEON™ SIMD sensor hub offloads signal processing tasks at microamp current levels.The LPDDR2, LVDDR3, DDR3 memory architecture implements state-retentive power gating for zero-leakage data preservation during sleep modes.Yes display controller operates with adaptive refresh rates to minimize power consumption in e-paper applications.Keypad, LCD interfaces support direct connection to ultra-low-power displays common in wearable devices.10/100Mbps (1) PHY includes energy-efficient Ethernet support for green networking applications.The USB 2.0 + PHY (3) interface implements low-power link states while maintaining instant wake-on-connect functionality.1.2V, 1.8V, 3.0V flexible I/O banks allow direct interfacing with energy harvesting circuits without level shifters.Specified for 0°C ~ 95°C (TJ) operation, the processor maintains functionality in environmental monitoring applications.Power-optimized ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection include cryptographic accelerators with minimal energy overhead for secure IoT communications.The 432-TFBGA package minimizes thermal mass for rapid wake-up from deep sleep states.Offered in 432-MAPBGA (13x13), the device supports thin-film battery integration in wearable designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A9
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.0GHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 2.0 + PHY (3)
- Voltage - I/O: 1.2V, 1.8V, 3.0V
- Operating Temperature: 0°C ~ 95°C (TJ)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Package / Case: 432-TFBGA
- Supplier Device Package: 432-MAPBGA (13x13)