MCIMX6X1CVO08AB
NXP USA Inc.
MCIMX6X1CVO08AB
NXP USA Inc.
IC MPU 32BIT I.MX6 800MHZ 400BGA
Reference Price (USD)
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$33.00140
500+
$32.671386
1000+
$32.341372
1500+
$32.011358
2000+
$31.681344
2500+
$31.35133
Exquisite packaging
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MCIMX6X1CVO08AB
$33.00
Product details
NXP USA Inc.'s MCIMX6X1CVO08AB revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The ARM® Cortex®-A9, ARM® Cortex®-M4 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 2 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 200MHz, 800MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.The Multimedia; NEON™ MPE units accelerate OFDM processing and channel coding algorithms.High-bandwidth LPDDR2, LVDDR3, DDR3 memory interfaces support the massive data flows characteristic of 5G signal processing.No graphics capabilities enable visualization of network performance metrics in real-time.The Keypad, LCD interfaces support remote management consoles for network equipment.10/100/1000Mbps (2) implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) interfaces enable flexible configuration and debugging of network equipment during deployment.1.8V, 2.5V, 2.8V, 3.15V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for -40°C ~ 105°C (TA) operation, the processor maintains performance in outdoor radio unit installations.Carrier-grade A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE protect network infrastructure from both physical and cyber threats.The 400-LFBGA package design optimizes thermal performance for continuous high-load operation.Available in 400-MAPBGA (17x17), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 200MHz, 800MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
- Package / Case: 400-LFBGA
- Supplier Device Package: 400-MAPBGA (17x17)
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