MCIMX6Y2DVK09AB
NXP USA Inc.
MCIMX6Y2DVK09AB
NXP USA Inc.
I.MX6ULL ROM PERF ENHAN
Reference Price (USD)
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$14.59819
500+
$14.4522081
1000+
$14.3062262
1500+
$14.1602443
2000+
$14.0142624
2500+
$13.8682805
Exquisite packaging
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MCIMX6Y2DVK09AB
$14.60
Product details
NXP USA Inc.'s MCIMX6Y2DVK09AB revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The ARM® Cortex®-A7 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 900MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.The Multimedia; NEON™ MPE units accelerate OFDM processing and channel coding algorithms.High-bandwidth LPDDR2, DDR3, DDR3L memory interfaces support the massive data flows characteristic of 5G signal processing.No graphics capabilities enable visualization of network performance metrics in real-time.The Electrophoretic, LCD interfaces support remote management consoles for network equipment.10/100Mbps (1) implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.USB 2.0 OTG + PHY (2) interfaces enable flexible configuration and debugging of network equipment during deployment.1.8V, 2.8V, 3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for 0°C ~ 95°C (TJ) operation, the processor maintains performance in outdoor radio unit installations.Carrier-grade A-HAB, ARM TZ, CSU, SJC, SNVS protect network infrastructure from both physical and cyber threats.The 272-LFBGA package design optimizes thermal performance for continuous high-load operation.Available in 272-MAPBGA (9x9), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A7
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 900MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, DDR3, DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: Electrophoretic, LCD
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 2.0 OTG + PHY (2)
- Voltage - I/O: 1.8V, 2.8V, 3.3V
- Operating Temperature: 0°C ~ 95°C (TJ)
- Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
- Package / Case: 272-LFBGA
- Supplier Device Package: 272-MAPBGA (9x9)
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