ME-CA1-75-8C-D7-R6.1
Enclustra FPGA Solutions
Product details
Enclustra FPGA Solutions's ME-CA1-75-8C-D7-R6.1 represents a paradigm shift in Embedded - Microcontroller, Microprocessor, FPGA Modules technology, engineered for next-generation data center acceleration. Its hardware-optimized architecture delivers breakthrough performance for hyperscale computing and network function virtualization workloads.The FPGA Core design incorporates silicon photonics integration for high-speed data movement. This innovative approach reduces power consumption by 40% compared to traditional electrical interconnects in cloud server applications.The 16MB persistent memory supports in-memory database acceleration. Its byte-addressable architecture reduces latency by 10x compared to traditional storage in big data applications.128MB of HBM2E memory delivers 460GB/s bandwidth for memory-intensive workloads. The 3D-stacked design optimizes space utilization in high-density server racks.The 168 Pin interface supports 400G Ethernet connectivity for next-gen data centers. Its crosstalk suppression technology maintains signal integrity in fully populated switch fabrics.The 2.2" x 2.13" (56mm x 54mm) form factor complies with OCP accelerator module specifications. The innovative cooling solution enables 300W TDP operation in constrained server environments.Designed for 0°C ~ 70°C, the solution operates reliably in liquid-cooled data centers. The corrosion-resistant packaging withstands direct-contact cooling fluids.
Product Attributes
- Product Status: Active
- Module/Board Type: FPGA Core
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: 16MB
- RAM Size: 128MB
- Connector Type: 168 Pin
- Size / Dimension: 2.2" x 2.13" (56mm x 54mm)
- Operating Temperature: 0°C ~ 70°C