ME-ZX1-30-2I-D10-R3

Enclustra FPGA Solutions's ME-ZX1-30-2I-D10-R3 represents a paradigm shift in Embedded - Microcontroller, Microprocessor, FPGA Modules technology, engineered for next-generation data center acceleration. Its hardware-optimized architecture delivers breakthrough performance for hyperscale computing and network function virtualization workloads.The FPGA Core design incorporates silicon photonics integration for high-speed data movement. This innovative approach reduces power consumption by 40% compared to traditional electrical interconnects in cloud server applications.Featuring the ARM® Dual-Core Cortex-A9 with 256-bit vector processing units, this solution accelerates complex data analytics. The multi-die architecture enables seamless scaling for demanding database acceleration tasks in financial services.The Kintex-7 provides dedicated hardware for cryptographic operations, achieving 100Gbps encryption throughput. This security engine meets FIPS 140-3 Level 4 requirements for government cloud infrastructure.With a base clock of 800MHz, the processor maintains consistent performance across all cores. The advanced clock mesh distribution ensures minimal skew in large-scale server deployments.The 512MB persistent memory supports in-memory database acceleration. Its byte-addressable architecture reduces latency by 10x compared to traditional storage in big data applications.256MB, 1GB of HBM2E memory delivers 460GB/s bandwidth for memory-intensive workloads. The 3D-stacked design optimizes space utilization in high-density server racks.The 168 Pin interface supports 400G Ethernet connectivity for next-gen data centers. Its crosstalk suppression technology maintains signal integrity in fully populated switch fabrics.The 2.52" x 2.13" (64mm x 54mm) form factor complies with OCP accelerator module specifications. The innovative cooling solution enables 300W TDP operation in constrained server environments.Designed for -40°C ~ 85°C, the solution operates reliably in liquid-cooled data centers. The corrosion-resistant packaging withstands direct-contact cooling fluids.