MEC1727N-B0-I/LJ

Microchip Technology introduces MEC1727N-B0-I/LJ, a breakthrough in Embedded - Microcontrollers - Application Specific for high-speed data acquisition systems. This application-specific microcontroller combines 16-bit ADCs with jitter-cleaning PLLs, enabling precision measurement in test and measurement equipment.Engineered for Keyboard and Embedded Controller implementations, the device includes hardware-accelerated windowed FFT processing. The analog front-end achieves 90dB SFDR at 10MSPS sampling rates.The ARM® Cortex®-M4F architecture features SIMD operations for vectorized signal processing. The deterministic interrupt latency ensures precise timing of acquisition triggers.With OTP (512kB) flexibility, the memory subsystem supports real-time waveform storage. The dual-bank architecture enables continuous streaming without throughput gaps.As a member of the MEC172x family, this device shares calibration algorithms with related products. The consistent measurement API simplifies instrument design.The 416kB memory implements ECC protection for measurement integrity. The multi-port architecture allows simultaneous access from acquisition and processing units.The ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI, UART connectivity includes JESD204B serial links with 12.5Gbps lanes. Each transceiver implements adaptive equalization for long-reach backplane connections.Providing 155 configurable ports, the device supports direct sensor excitation. Each analog output includes 20-bit calibration coefficients in OTP memory.Operating from 1.71V ~ 3.465V sources, the power architecture achieves 100dB PSRR. The integrated voltage references maintain 1ppm/ C stability for precision measurements.Rated for -40°C ~ 85°C (TA) operation, the package uses low-thermal EMF materials. The symmetrical design minimizes thermocouple effects in sensitive circuits.The Surface Mount configuration supports impedance-controlled PCB layouts. The package footprint includes guard ring connections for sensitive analog sections.Available in 176-WFBGA format, the package features gold-plated pads for contact reliability. The low-ESL design maintains signal integrity up to 3GHz bandwidth.Supplied in 176-WFBGA (10x10) configuration, each unit includes individual calibration reports. Production testing includes full characterization across temperature.