MI21-50PD-SF-EJL
Hirose Electric Co Ltd
MI21-50PD-SF-EJL
Hirose Electric Co Ltd
CONN COMPACT FLASH CARD R/A SMD
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Product details
The MI21-50PD-SF-EJL from Hirose Electric Co Ltd delivers military-grade reliability for Memory Connectors - PC Card Sockets applications in aerospace and defense systems. Engineered to meet MIL-STD-810 standards, this connector maintains signal integrity in extreme environmental conditions.Supporting CompactFlash® - Type I, II formats, the connector enables secure data transfer in avionics systems. Its tamper-resistant design meets stringent requirements for classified information handling.The 50 contact array has been radiation-hardened for space applications. Each contact is individually tested to ensure performance in high-vacuum conditions.The Connector and Ejector design incorporates hermetic sealing for operation in pressurized aircraft cabins. The connector maintains performance from -55 C to 125 C without degradation.With Push In, Push Out operation, the connector enables quick module replacement in field conditions. The positive engagement mechanism provides audible confirmation of proper mating.The Left configuration has been optimized for operation with gloved hands. The oversized ejector lever functions reliably in -40 C conditions.The Surface Mount, Right Angle variant features corrosion-resistant mounting hardware suitable for naval applications. All metallic components are treated to resist salt fog per MIL-STD-883.The Board Guide include EMI/RFI shielding that exceeds MIL-STD-461 requirements. The multi-layer shielding approach provides 360 protection against electromagnetic interference.The 0.281" (7.15mm) ultra-low profile meets strict height constraints in airborne electronics. The design maintains structural integrity under 15G vibration loads.Available in Normal, Standard - Top configurations, the connector supports both chassis and PCB mounting. The reverse-mount option is particularly useful in stacked avionics modules.The Gold plating has been qualified for 1,000 mating cycles in sandy environments. This ruggedized surface treatment prevents particulate-induced contact wear.With 3.94µin (0.10µm) gold plating, the contacts maintain stable resistance through thermal cycling. The plating process has been certified to NASA outgassing standards.
Product Attributes
- Product Status: Obsolete
- Card Type: CompactFlash® - Type I, II
- Number of Positions: 50
- Connector Type: Connector and Ejector
- Insertion, Removal Method: Push In, Push Out
- Ejector Side: Left
- Mounting Type: Surface Mount, Right Angle
- Features: Board Guide
- Height Above Board: 0.281" (7.15mm)
- Mounting Feature: Normal, Standard - Top
- Contact Finish: Gold
- Contact Finish Thickness: 3.94µin (0.10µm)