MIMX8MD6CVAHZAA
NXP USA Inc.
MIMX8MD6CVAHZAA
NXP USA Inc.
I.MX 8MDUAL 17X17 NO LID
Reference Price (USD)
1+
$73.27000
500+
$72.5373
1000+
$71.8046
1500+
$71.0719
2000+
$70.3392
2500+
$69.6065
Exquisite packaging
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MIMX8MD6CVAHZAA
$73.27
Product details
The MIMX8MD6CVAHZAA by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A53 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 2 Core, 64-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 1.3GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The ARM® Cortex®-M4 neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DDR3L, DDR4, LPDDR4 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.Yes GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting eDP, HDMI, MIPI-CSI, MIPI-DSI outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.GbE connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 3.0 (2) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Rated for -40°C ~ 105°C (TJ) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS include model encryption and secure model update mechanisms for protected edge AI deployments.The 621-FBGA, FCBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 621-FCPBGA (17x17), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1.3GHz
- Co-Processors/DSP: ARM® Cortex®-M4
- RAM Controllers: DDR3L, DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: eDP, HDMI, MIPI-CSI, MIPI-DSI
- Ethernet: GbE
- SATA: -
- USB: USB 3.0 (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
- Package / Case: 621-FBGA, FCBGA
- Supplier Device Package: 621-FCPBGA (17x17)
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