MIMX8ML8CVNKZAB
NXP USA Inc.
MIMX8ML8CVNKZAB
NXP USA Inc.
IC I.MX 8M PLUS QUAD BGA
Reference Price (USD)
1+
$67.30000
500+
$66.627
1000+
$65.954
1500+
$65.281
2000+
$64.608
2500+
$63.935
Exquisite packaging
Discount
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MIMX8ML8CVNKZAB
$67.30
Product details
The MIMX8ML8CVNKZAB from NXP USA Inc. delivers military-grade reliability in the Embedded - Microprocessors category, hardened for aerospace and defense applications. This radiation-hardened microprocessor combines triple-modular redundancy with error-correcting architectures, meeting MIL-STD-883 requirements for mission-critical systems.Featuring a ARM® Cortex®-A53 radiation-hardened core, the processor implements lockstep execution with cycle-by-cycle comparison for fault detection.The 4 Core, 64-Bit configuration includes redundant execution units for single-event upset mitigation in space applications.Operating at 1.8GHz, the device meets the real-time processing requirements of spacecraft attitude control systems.The ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP units include radiation-hardened floating-point accelerators for spacecraft navigation.DDR4, LPDDR4 memory interfaces incorporate SECDED ECC protection for single-event upset mitigation in orbit.Yes display controllers include radiation-hardened frame buffers for critical spacecraft displays.The MIPI-CSI, MIPI-DSI interfaces implement MIL-STD-1553 protocol support for aerospace databuses.GbE (2) implementations include space-grade PHYs with enhanced EMI characteristics for spacecraft applications.The USB 2.0 + PHY (2), USB 3.0 + PHY (2) interfaces meet MIL-STD-1275 requirements for military vehicle power environments.Qualified for -40°C ~ 105°C (TJ) operation, the processor functions in extreme space and high-altitude environments.Military-grade ARM TZ, CAAM, RDC include TEMPEST-approved cryptographic modules for secure communications.The 568-LFBGA package implements hermetic sealing for protection against moisture and contaminants.Available in 568-LFBGA (15x15), the device supports military-grade PCB assembly processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 4 Core, 64-Bit
- Speed: 1.8GHz
- Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
- RAM Controllers: DDR4, LPDDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: MIPI-CSI, MIPI-DSI
- Ethernet: GbE (2)
- SATA: -
- USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: ARM TZ, CAAM, RDC
- Package / Case: 568-LFBGA
- Supplier Device Package: 568-LFBGA (15x15)
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