MM908E624AYEWR2
NXP USA Inc.
MM908E624AYEWR2
NXP USA Inc.
IC TRPL SWITCH MCU/LIN 54-SOIC
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Product details
The MM908E624AYEWR2 from NXP USA Inc. establishes a new paradigm in Embedded - Microcontrollers - Application Specific, crafted for aerospace and defense systems. This radiation-hardened microcontroller delivers fault-tolerant computing with SEU (Single Event Upset) mitigation techniques, ensuring reliable operation in space environments.Designed for Automotive Mirror Control deployments, the device incorporates triple-modular redundancy for critical processing paths. Its MIL-STD-883 qualified design withstands total ionizing dose effects up to 300krad(Si).Powered by HC08 architecture, the CPU implements error-correcting register files and parity-protected caches. The dual-core design achieves 99.999% fault coverage through lockstep operation.With FLASH (16kB) configuration, the memory subsystem employs scrubbing algorithms for SEU recovery. The EDAC-protected flash maintains data integrity even under heavy particle bombardment.As part of the 908E family, this device shares radiation mitigation strategies with flight-proven designs. The common architecture reduces qualification effort for new missions.The 512 x 8 memory implements SECDED (Single Error Correction, Double Error Detection) across all banks. Refresh cycles are managed by radiation-hardened controllers.The SCI, SPI suite includes SpaceWire links with 200Mbps throughput. Each communication channel features transformer isolation meeting ESA ECSS standards.Providing 16 radiation-hardened ports, the GPIO matrix supports LVDS signaling. Each I/O cell includes single-event transient filters for glitch suppression.Operating across 5.5V ~ 18V ranges, the power system implements single-event burnout protection. The distributed voltage regulators maintain operation during solar flare events.Rated for -40°C ~ 125°C extremes, the package utilizes ceramic substrates with gold metallization. Thermal vias maintain junction temperatures in vacuum conditions.The Surface Mount configuration supports hermetic sealing processes. Die attachment uses AuSi eutectic bonding for mechanical stability under vibration.Available in 54-BSSOP (0.295", 7.50mm Width) format, the package features Kovar leads for CTE matching. Internal getters maintain low moisture levels throughout mission life.Delivered in 54-SOIC, each unit undergoes proton irradiation testing. Lot traceability documentation includes radiation test certificates.
Product Attributes
- Product Status: Obsolete
- Applications: Automotive Mirror Control
- Core Processor: HC08
- Program Memory Type: FLASH (16kB)
- Controller Series: 908E
- RAM Size: 512 x 8
- Interface: SCI, SPI
- Number of I/O: 16
- Voltage - Supply: 5.5V ~ 18V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Surface Mount
- Package / Case: 54-BSSOP (0.295", 7.50mm Width)
- Supplier Device Package: 54-SOIC