MP2-H030-51S1-S-LR
3M
MP2-H030-51S1-S-LR
3M
CONN HEADER FUTUREBUS+ 30POS PCB
Reference Price (USD)
1+
$6.16000
500+
$6.0984
1000+
$6.0368
1500+
$5.9752
2000+
$5.9136
2500+
$5.852
Exquisite packaging
Discount
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MP2-H030-51S1-S-LR
$6.16
Product details
The MP2-H030-51S1-S-LR from 3M represents a cutting-edge solution in Backplane Connectors - Specialized, engineered for high-density backplane applications requiring exceptional signal integrity. This advanced connector system combines robust construction with precision engineering to deliver reliable performance in mission-critical environments.Designed specifically for Backplane applications, this product series delivers proven performance in high-speed digital systems up to 56Gbps NRZ.With Header, Male Pins configuration, this component ensures optimal mating compatibility while maintaining superior electrical characteristics. The hermaphroditic contact design enhances assembly flexibility in complex systems.Featuring Futurebus+® technology, the connector achieves industry-leading contact reliability, particularly beneficial for high-vibration environments found in industrial automation equipment.The 30 position count provides exceptional scalability for backplane architectures, enabling designers to implement modular system designs with simplified interconnect schemes.When configured with All loaded positions, the connector offers customizable solutions for power distribution networks without compromising signal path density.With 0.079" (2.00mm) centerline spacing, the design achieves optimal balance between high-density packaging and manufacturability requirements.The 5 row configuration enables three-dimensional backplane stacking, particularly valuable in data center orthogonal interconnect architectures.The Through Hole mounting option facilitates both standard and high-reliability PCB attachment methods, with proven performance in through-hole reflow processes.Solder methods provide flexibility for both automated assembly processes and field-serviceable connections in telecom infrastructure.Incorporating Board Guide, Mating Guide, this connector system addresses EMI shielding requirements while providing positive latching mechanisms essential for vibration-resistant installations.Gold plating ensures durable contact surfaces capable of withstanding multiple mating cycles, meeting MIL-STD-202H standards for harsh environment operation.The 3.00µin (0.076µm) coating thickness exceeds industry standards for corrosion resistance, ensuring long-term reliability in humid operating conditions.The Beige housing material complies with UL94V-0 flammability ratings while providing visual differentiation for complex cabling systems.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane
- Connector Type: Header, Male Pins
- Connector Style: Futurebus+®
- Number of Positions: 30
- Number of Positions Loaded: All
- Pitch: 0.079" (2.00mm)
- Number of Rows: 5
- Number of Columns: -
- Mounting Type: Through Hole
- Termination: Solder
- Contact Layout, Typical: -
- Features: Board Guide, Mating Guide
- Contact Finish: Gold
- Contact Finish Thickness: 3.00µin (0.076µm)
- Color: Beige
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