MPC303025T

AMEC Thermasol

General info

Part Number

MPC303025T

Manufacturer

AMEC Thermasol

Description:

CERAMIC HEAT SINK - FLAT TYPE

Reference Price (USD)

$1.39000

500+

$1.3761

1000+

$1.3622

1500+

$1.3483

2000+

$1.3344

2500+

$1.3205

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

MPC303025T

$1.39

Product details

AMEC Thermasol's MPC303025T delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 1.181" (30.00mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 1.181" (30.00mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 0.108" (2.75mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.