MPC603RRX200TC
NXP USA Inc.
MPC603RRX200TC
NXP USA Inc.
IC MPU MPC6XX 200MHZ 255FCCBGA
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Product details
The MPC603RRX200TC by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a PowerPC 603e neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 200MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Designed with 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 105°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.The 255-BCBGA, FCCBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 255-FCCBGA (21x21), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC 603e
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 200MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 255-BCBGA, FCCBGA
- Supplier Device Package: 255-FCCBGA (21x21)
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