MPC755BPX300LE
NXP USA Inc.
MPC755BPX300LE
NXP USA Inc.
IC MPU MPC7XX 300MHZ 360FCBGA
Reference Price (USD)
1+
$153.14000
500+
$151.6086
1000+
$150.0772
1500+
$148.5458
2000+
$147.0144
2500+
$145.483
Exquisite packaging
Discount
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MPC755BPX300LE
$153.14
Product details
The MPC755BPX300LE from NXP USA Inc. delivers automotive-grade performance in the Embedded - Microprocessors segment, developed for next-generation vehicle electronics. This AEC-Q100 qualified microprocessor combines functional safety features with high computational density, meeting stringent automotive reliability requirements.Based on the PowerPC architecture, the processor delivers ASIL-D compliant performance for safety-critical automotive applications.The 1 Core, 32-Bit configuration provides redundant processing paths required for fault-tolerant automotive systems.With operating speeds up to 300MHz, the device meets the real-time requirements of advanced driver assistance systems (ADAS).No graphics support enables rendering of high-resolution instrument clusters and head-up displays.2.5V, 3.3V tolerant I/Os ensure reliable operation across the automotive voltage range.Qualified for 0°C ~ 105°C (TA) operation, the processor functions reliably in extreme automotive environments.The 360-BBGA, FCBGA package meets automotive reliability standards for thermal cycling and mechanical stress.Available in 360-FCPBGA (25x25), the device supports automotive PCB assembly processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 300MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-BBGA, FCBGA
- Supplier Device Package: 360-FCPBGA (25x25)
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