MPC755BVT300LE
Freescale Semiconductor
MPC755BVT300LE
Freescale Semiconductor
RISC MICROPROCESSOR
Reference Price (USD)
1+
$94.49000
500+
$93.5451
1000+
$92.6002
1500+
$91.6553
2000+
$90.7104
2500+
$89.7655
Exquisite packaging
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MPC755BVT300LE
$94.49
Product details
Freescale Semiconductor's MPC755BVT300LE revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The PowerPC core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 300MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.No graphics capabilities enable visualization of network performance metrics in real-time.2.5V, 3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for 0°C ~ 105°C (TA) operation, the processor maintains performance in outdoor radio unit installations.The 360-BBGA, FCBGA package design optimizes thermal performance for continuous high-load operation.Available in 360-FCPBGA (25x25), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 300MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-BBGA, FCBGA
- Supplier Device Package: 360-FCPBGA (25x25)
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