MPC8247ZQMIBA
NXP USA Inc.
MPC8247ZQMIBA
NXP USA Inc.
IC MPU MPC82XX 266MHZ 516BGA
Reference Price (USD)
1+
$40.71000
500+
$40.3029
1000+
$39.8958
1500+
$39.4887
2000+
$39.0816
2500+
$38.6745
Exquisite packaging
Discount
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MPC8247ZQMIBA
$40.71
Product details
NXP USA Inc.'s MPC8247ZQMIBA sets new benchmarks in the Embedded - Microprocessors market segment, optimized for compute-intensive embedded applications. This system-on-chip solution integrates advanced processing cores with sophisticated power management, delivering exceptional performance-per-watt characteristics for energy-conscious designs.The PowerPC G2_LE architecture provides deterministic execution of real-time tasks while maintaining low power consumption, making it particularly suitable for battery-powered edge computing devices.Architected with 1 Core, 32-Bit capability, the processor enables efficient task partitioning and memory bandwidth utilization in multi-threaded applications.With clock speeds up to 266MHz, the device meets the computational demands of advanced motor control algorithms and power conversion systems.The Communications; RISC CPM acceleration units significantly enhance performance for matrix operations common in AI inference tasks.Support for DRAM, SDRAM memory technologies allows designers to optimize system cost and performance for specific application requirements.The No graphics subsystem enables smooth rendering of complex graphical user interfaces without external GPU components.10/100Mbps (2) connectivity options provide the necessary bandwidth for industrial communication protocols including EtherCAT and PROFINET.USB 2.0 (1) implementations adhere to the latest USB standards, ensuring backward compatibility while supporting high-speed data transfers.The 3.3V I/O banks offer design flexibility for interfacing with various peripheral devices in industrial control systems.Qualified for 0°C ~ 105°C (TA) operation, the processor reliably functions in outdoor telecommunications equipment and base station applications.The 516-BBGA package design incorporates advanced thermal management features for reliable operation in confined spaces.Offered in 516-PBGA (27x27), the device supports both conventional and advanced PCB assembly techniques.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC G2_LE
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 516-BBGA
- Supplier Device Package: 516-PBGA (27x27)
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