MPC8313ECVRAFF
NXP USA Inc.
MPC8313ECVRAFF
NXP USA Inc.
IC MPU MPC83XX 333MHZ 516BGA
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Product details
The MPC8313ECVRAFF by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a PowerPC e300c3 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 333MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Security; SEC 2.2 neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DDR, DDR2 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.10/100/1000Mbps (2) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 + PHY (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.8V, 2.5V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 105°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented Cryptography include model encryption and secure model update mechanisms for protected edge AI deployments.The 516-BBGA Exposed Pad package incorporates advanced heat spreading technology for sustained AI workloads.Available in 516-TEPBGA (27x27), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 333MHz
- Co-Processors/DSP: Security; SEC 2.2
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography
- Package / Case: 516-BBGA Exposed Pad
- Supplier Device Package: 516-TEPBGA (27x27)
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