MS3456L18-8P-LC

Conesys

General info

Part Number

MS3456L18-8P-LC

Manufacturer

Conesys

Description:

CONN PLG HSG MALE 8POS INLINE

Reference Price (USD)

$53.38000

500+

$52.8462

1000+

$52.3124

1500+

$51.7786

2000+

$51.2448

2500+

$50.711

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

MS3456L18-8P-LC

$53.38

Product details

The MS3456L18-8P-LC by Conesys delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Plug Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Male Pins implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 8 configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.Compatible with 18-8 inserts, allowing customized signal routing. The thermally isolated insert prevents heat transfer between stages.Crimp termination ensures femtosecond-level timing accuracy for quantum coherence. The superconducting contacts maintain <0.01 phase stability.Designed for 12 (1), 16 (7) contacts, the current capacity reaches 100A in superconducting state. The optimized geometry minimizes eddy current losses.The Free Hanging (In-Line) installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.Threaded mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.Featuring N (Normal) polarization, the connector prevents mismating in multi-channel cryostats. The precision keying system maintains 0.01mm alignment tolerance.The Aluminum construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.Electroless Nickel surface treatment maintains <0.1 contact resistance at 4K. The coating withstands 1000+ vacuum cycles without degradation.Rated IP67 - Dust Tight, Waterproof, the design maintains 10^-10 Torr vacuum integrity. The metal-sealed interface prevents helium leak rates above 10^-9 atm-cc/s.Shielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.