MU14-6FLK
3M
MU14-6FLK
3M
CONN SPADE TERM 14-16AWG #6
Reference Price (USD)
1+
$0.44000
500+
$0.4356
1000+
$0.4312
1500+
$0.4268
2000+
$0.4224
2500+
$0.418
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
The MU14-6FLK from 3M revolutionizes Terminals - Spade Connectors performance for quantum computing applications. This cryogenic-rated connector maintains signal integrity at 4K temperatures while providing ultra-low noise characteristics. Its innovative design addresses the unique challenges of superconducting circuit interconnects.Featuring Spring, Snap architecture, this connector minimizes thermal conductivity while maintaining RF shielding. The non-magnetic design prevents flux trapping in sensitive quantum circuits.Precision-engineered to 6 Stud specifications, this interface maintains 50 impedance at millikelvin temperatures. The superconducting contacts exhibit zero DC resistance.With 0.250" (6.35mm) dimensions, this connector enables high-density qubit interconnections. The atomic-level smooth edges prevent vortex formation in superconducting materials.The 0.680" (17.27mm) profile incorporates thermal breaks that reduce heat leakage by 99%. This feature is critical for maintaining cryogenic stability.Designed for Free Hanging (In-Line) installations in dilution refrigerators, this connector survives repeated thermal cycling. The differential contraction design prevents mechanical stress.Utilizing Crimp technology, this connector achieves superconducting joints without thermal emf. The indium-based process is compatible with niobium-titanium circuits.Optimized for 14-16 AWG cryogenic wiring, this terminal maintains signal coherence for qubit control. The coaxial design provides 100dB isolation at 10GHz.The Non-Insulated material exhibits negligible dielectric loss at quantum frequencies. Special amorphous polymers prevent two-level system noise.With Butted Seam implementation, this connector provides active magnetic compensation. The integrated coils cancel stray fields below 1 T at qubit locations.Tin plating provides stable contact resistance from 300K to 10mK. The non-stick coating prevents cold welding during thermal cycles.The Copper, ETP formulation offers perfect lattice matching for superconducting films. Advanced intermetallics prevent proximity effect losses.
Product Attributes
- Product Status: Active
- Terminal Type: Spring, Snap
- Stud/Tab Size: 6 Stud
- Width - Outer Edges: 0.250" (6.35mm)
- Length - Overall: 0.680" (17.27mm)
- Mounting Type: Free Hanging (In-Line)
- Termination: Crimp
- Wire Gauge: 14-16 AWG
- Insulation: Non-Insulated
- Features: Butted Seam
- Color: -
- Contact Finish: Tin
- Contact Material: Copper, ETP