NET+50-BINP
Digi
NET+50-BINP
Digi
IC ARM7 MPU 32BIT 208BGA
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Product details
The NET+50-BINP by Digi pioneers ultra-low-power design in Embedded - Microcontrollers - Application Specific, specifically developed for energy harvesting applications. This application-specific microcontroller operates down to 0.8V supply voltage, enabling battery-less IoT deployments with multi-year operation.Tailored for Network Processor scenarios, the device includes nanowatt-range wake-up receivers. The energy-aware architecture achieves 98% duty cycle reduction through predictive sleep scheduling.Built around ARM7® technology, the CPU features subthreshold operation modes. The event-driven architecture consumes just 12 A/MHz during active processing.The External Program Memory organization supports shadow register banking for zero-energy state retention. The non-volatile memory maintains data at 0V supply through ferroelectric technology.As part of the NET+50 family, this microcontroller shares energy optimization tools with other members. The consistent power management API simplifies application development.The 16K x 8 memory implements ferroelectric retention for zero-power sleep. The memory controller includes energy-proportional access modes that scale with workload.Featuring EBI/EMI, Ethernet, DMA, HDLC, IEEE1284/ENI, SPI, UART connectivity, the device includes sub-1GHz RF frontends. Each communication peripheral implements adaptive impedance matching for energy-optimized transmission.With 40 ports, the GPIO subsystem features piezoelectric driver circuits. Configurable charge pumps enable direct energy harvesting from mechanical vibrations.Operating from 2.25V ~ 3.6V sources, the power management unit starts at 300mV input. The integrated maximum power point tracker optimizes energy extraction from solar cells.Rated for -40°C ~ 85°C operation, the device uses zero-leakage transistors. The package design minimizes thermal gradients that could affect energy harvesting efficiency.The Surface Mount configuration supports flexible PCB installations. The ultra-thin package enables integration into wearable form factors.The 208-LFBGA option features transparent lids for solar cell integration. The package material selection maximizes light transmission to underlying photovoltaic layers.Available in 208-BGA (15x15) format, each unit is tested with actual energy harvesting sources. Production includes verification of cold-start capability.
Product Attributes
- Product Status: Obsolete
- Applications: Network Processor
- Core Processor: ARM7®
- Program Memory Type: External Program Memory
- Controller Series: NET+50
- RAM Size: 16K x 8
- Interface: EBI/EMI, Ethernet, DMA, HDLC, IEEE1284/ENI, SPI, UART
- Number of I/O: 40
- Voltage - Supply: 2.25V ~ 3.6V
- Operating Temperature: -40°C ~ 85°C
- Mounting Type: Surface Mount
- Package / Case: 208-LFBGA
- Supplier Device Package: 208-BGA (15x15)