NS9360B-0-C177
Digi
NS9360B-0-C177
Digi
IC ARM9 MICROPROCESSOR 272BGA
Reference Price (USD)
1+
$51.61500
500+
$51.09885
1000+
$50.5827
1500+
$50.06655
2000+
$49.5504
2500+
$49.03425
Exquisite packaging
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NS9360B-0-C177
$51.62
Product details
Digi's NS9360B-0-C177 reimagines Embedded - Microcontrollers - Application Specific for smart grid and power conversion applications. This application-specific microcontroller integrates advanced PWM generation with high-resolution ADC capabilities, enabling precise control of power electronics.Optimized for Network Processor implementations, the device features hardware-based overcurrent protection with 50ns response time. The integrated sigma-delta modulators enable direct sensorless motor control.The ARM9® core includes dedicated trigonometric acceleration units. The parallel execution pipelines achieve 95% duty cycle accuracy at 100kHz switching frequencies.Supporting External Program Memory options, the flash memory incorporates shadow registers for bumpless firmware updates. The dual-plane architecture allows live updates during continuous operation.The External memory implements deterministic access timing for control loops. The dual-port architecture allows simultaneous access from CPU and PWM units.With EBI/EMI, Ethernet, DMA, I²C, IEEE 1284, LCD, SPI, UART, USB connectivity, the device supports EtherCAT POWERLINK protocols. Each communication peripheral includes reinforced isolation meeting IEC 61800-5-1 standards.The 73 configurable ports feature 12-bit DAC outputs for analog control. Programmable dead-time insertion prevents shoot-through in bridge configurations.Operating from 1.4V ~ 3.6V inputs, the power architecture withstands 100V transients. The integrated gate drivers support SiC and GaN power devices.Certified for 0°C ~ 70°C operation, the package uses direct-bonded copper substrates. Thermal impedance is minimized for high-current applications.The Surface Mount option supports press-fit assembly for high-power PCBs. The package design accommodates thick copper layers for heat dissipation.Available in 272-BBGA format, the package includes Kelvin sense connections. The low-inductance design minimizes switching losses at high di/dt rates.Supplied in 272-BGA (27x27) configuration, each unit includes power cycling test reports. Production testing includes 100% burn-in at maximum junction temperature.
Product Attributes
- Product Status: Not For New Designs
- Applications: Network Processor
- Core Processor: ARM9®
- Program Memory Type: External Program Memory
- Controller Series: -
- RAM Size: External
- Interface: EBI/EMI, Ethernet, DMA, I²C, IEEE 1284, LCD, SPI, UART, USB
- Number of I/O: 73
- Voltage - Supply: 1.4V ~ 3.6V
- Operating Temperature: 0°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: 272-BBGA
- Supplier Device Package: 272-BGA (27x27)
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