PK223-160-160-3.0

Shiu Li Technology Co., Ltd.'s PK223-160-160-3.0 introduces groundbreaking Thermal - Pads, Sheets technology for quantum computing applications. This ultra-precision thermal solution maintains cryogenic stability while providing exceptional thermal isolation for qubit control systems.Developed specifically for Thermally Conductive in quantum processors, this material operates effectively from 4K to 300K. Its unique thermal expansion properties match superconducting materials, preventing interface stress during temperature cycling.As a cryogenic Gap Filler Pad, Sheet, this product combines ultra-low thermal conductivity with perfect electrical insulation. The specially engineered dielectric properties prevent signal interference in sensitive quantum measurement circuits.Fabricated in precision Square configurations, this material accommodates complex qubit array geometries. The nanoscale-edge finishing ensures perfect interface contact without damaging delicate quantum components.With 160.00mm x 160.00mm dimensions, this solution fits standard dilution refrigerator cold plates. The size-optimized design allows for efficient thermal management in multi-layer quantum computing stacks.The atomically controlled 0.118" (3.00mm) provides perfect balance between thermal isolation and mechanical stability. This characteristic is critical for maintaining qubit coherence times in operating conditions.Featuring Tacky - Both Sides properties, this solution offers cryogenic-compatible bonding. The specialized formulation maintains adhesion integrity across extreme temperature ranges without outgassing.The White identification system facilitates quick material verification under cryogenic conditions. This specialized coloring remains visible even at liquid helium temperatures.Achieving 2.0W/m-K performance, this material provides precise thermal isolation for qubit arrays. The engineered phonon scattering properties enable fine-grained temperature control.