PM6110B-FEI
Microchip Technology
Product details
Microchip Technology's PM6110B-FEI redefines performance standards in Embedded - Microcontrollers - Application Specific, specifically developed for next-generation IoT edge nodes. This application-specific microcontroller combines ultra-low power consumption with robust security features, making it ideal for distributed sensor networks and smart city infrastructure.Designed for Networking and Communications implementations, the microcontroller's hardware security modules exceed FIPS-140-2 requirements. Its tamper-resistant design includes active shield technology for physical attack prevention.The Surface Mount option supports reflow profiles compatible with lead-free SAC305 solder. Package warpage is controlled to <0.05mm for high-yield assembly processes.Available in 1221-BBGA format, the package incorporates stress-relief features for improved board-level reliability. Moisture sensitivity meets JEDEC J-STD-020D Level 3 standards.Supplied in 1221-BBGA (29x29) configuration, each unit includes unique cryptographic identifiers for supply chain authentication. Tape-and-reel packaging supports automated pick-and-place assembly.
Product Attributes
- Product Status: Active
- Applications: Networking and Communications
- Core Processor: -
- Program Memory Type: -
- Controller Series: -
- RAM Size: -
- Interface: -
- Number of I/O: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 1221-BBGA
- Supplier Device Package: 1221-BBGA (29x29)