PXP6011/08S/CR/0405

Bulgin

General info

Part Number

PXP6011/08S/CR/0405

Manufacturer

Bulgin

Description:

CONN RCPT HSG FMALE 8POS INLINE

Datasheet:

PXP6011/08S/CR/0405 PDF

Reference Price (USD)

$13.74367

500+

$13.6062333

1000+

$13.4687966

1500+

$13.3313599

2000+

$13.1939232

2500+

$13.0564865

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

PXP6011/08S/CR/0405

$13.74

Product details

The PXP6011/08S/CR/0405 by Bulgin delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Receptacle Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Female Sockets implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 8 (Power) configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.Crimp and Solder Cup termination ensures femtosecond-level timing accuracy for quantum coherence. The superconducting contacts maintain <0.01 phase stability.The Free Hanging (In-Line) installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.Push-Twist mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.Featuring Keyed polarization, the connector prevents mismating in multi-channel cryostats. The precision keying system maintains 0.01mm alignment tolerance.Using Plastic formulation, the connector exhibits negligible thermal emf (<0.1 V/K). The material's thermal conductivity is tailored for cryogenic heat sinking.The Polycarbonate/Polybutylene Terephthalate (PBT), Halogen Free construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.The Gray coding system facilitates quick identification in complex quantum computing setups. The non-outgassing pigments are compatible with ultra-high vacuum.Rated IP66/IP68/IP69K - Dust Tight, Water Resistant, Waterproof, the design maintains 10^-10 Torr vacuum integrity. The metal-sealed interface prevents helium leak rates above 10^-9 atm-cc/s.Compliant with UL94 V-0 standards, the materials produce zero toxic outgassing. Critical for cleanroom applications requiring NASA outgassing compliance.Integrated Backshell include superconducting contacts for zero-resistance signal paths. The niobium-titanium alloy contacts transition below 9.3K critical temperature.Unshielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.