Q3-0.005-00-105

The Q3-0.005-00-105 by Bergquist sets new benchmarks in Thermal - Pads, Sheets technology for automotive electronics. This ruggedized thermal solution combines exceptional durability with industry-leading thermal performance, making it ideal for under-hood applications and electric vehicle power systems.Engineered specifically for SIP requirements, this thermal pad maintains performance under mechanical vibration and thermal shock conditions. Its unique composition resists pump-out effects common in dynamic automotive environments.As a high-performance Pad, Sheet, this product offers superior conformability to irregular surfaces. The viscoelastic properties ensure maximum interface contact even with components exhibiting surface warpage or roughness.Manufactured in precision Rectangular configurations, this material facilitates efficient thermal pathway design. The optimized geometries minimize thermal impedance while accommodating space constraints in compact automotive modules.Standard 36.83mm x 21.29mm dimensions ensure compatibility with common power electronics packaging. The size-optimized design allows for efficient thermal management without requiring custom tooling.The precisely controlled 0.0050" (0.127mm) provides optimal balance between thermal transfer and mechanical compliance. This characteristic is particularly valuable in applications requiring vibration damping alongside thermal management.Formulated with advanced Elastomer technology, this pad exhibits exceptional resistance to automotive fluids and chemicals. This property ensures long-term reliability in harsh operating environments.The durable Fiberglass provides excellent handling characteristics during automated assembly processes. This feature significantly reduces installation time while maintaining placement accuracy.The Black identification system enables quick visual verification during quality inspections. This feature is particularly valuable in high-volume manufacturing environments.With an ultra-low 0.35°C/W rating, this material minimizes thermal bottlenecks in critical heat paths. The optimized molecular structure facilitates rapid heat transfer away from sensitive components.Delivering 2.0W/m-K performance, this material enables more efficient thermal designs. The isotropic properties ensure uniform heat spreading across the entire interface area.