R7F701304EAFP-C#AA1
Renesas Electronics America Inc
Product details
Renesas Electronics America Inc's R7F701304EAFP-C#AA1 delivers military-grade reliability in Embedded - Microcontrollers, developed for aerospace and defense applications where radiation tolerance and mission longevity are paramount.The RH850G3M core incorporates triple modular redundancy for SEU mitigation, achieving >99% single-event upset immunity in orbital radiation environments.A 32-Bit Single-Core architecture with parity-protected data paths prevents silent data corruption, meeting MIL-STD-883G requirements for spaceborne electronics.When operating at 160MHz, the microcontroller maintains timing accuracy within 0.01% despite temperature variations from -55 C to 125 C, critical for navigation systems.The CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART interfaces implement Manchester encoding for noise-immune data transmission, ensuring reliable communication in high-EMI environments like radar installations.LVD, POR, PWM, WDT include radiation-hardened timers and watchdog circuits that automatically recover from single-event functional interrupts within 10 s.With 52 MIL-STD-1553-compatible interfaces, the device can serve as a remote terminal in distributed avionics architectures without external transceivers.2MB (2M x 8) of TMR-protected storage accommodates flight control algorithms with full error detection and correction capabilities.The FLASH implementation uses SONOS technology that withstands 300krad total ionizing dose, exceeding space qualification requirements.64K x 8 of scrubable memory prevents accumulation of single-event upsets, maintaining data integrity during extended missions in high-radiation orbits.The 3V ~ 5.5V range supports operation from unregulated spacecraft power buses with 100mV ripple, eliminating need for additional regulation stages.Precision A/D 24x12b maintain 12-bit accuracy during solar flare events, providing reliable telemetry data even during peak radiation periods.The Internal clock source incorporates automatic frequency compensation that maintains <1ppm/ C drift across the military temperature range.Surface Mount packaging uses AuSn die attach for superior thermal conductivity in vacuum environments, preventing die delamination during thermal transients.The 100-LQFP format provides hermetic sealing against moisture ingress, meeting MIL-PRF-38534 Class K requirements for high-reliability applications.Available in 100-LFQFP (14x14), the microcontroller undergoes rigorous screening including burn-in and 100% electrical testing at temperature extremes.
Product Attributes
- Product Status: Active
- Core Processor: RH850G3M
- Core Size: 32-Bit Single-Core
- Speed: 160MHz
- Connectivity: CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART
- Peripherals: LVD, POR, PWM, WDT
- Number of I/O: 52
- Program Memory Size: 2MB (2M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 64K x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LFQFP (14x14)