R8A77210C133BGV
Renesas Electronics America Inc
R8A77210C133BGV
Renesas Electronics America Inc
IC MCU 32BIT ROMLESS 256CSP
Reference Price (USD)
1+
$33.56700
500+
$33.23133
1000+
$32.89566
1500+
$32.55999
2000+
$32.22432
2500+
$31.88865
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
R8A77210C133BGV
$33.57
Product details
Renesas Electronics America Inc's R8A77210C133BGV revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The SH-3 DSP core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 133MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for -20°C ~ 75°C (TA) operation, the processor maintains performance in outdoor radio unit installations.The 81-LFBGA package design optimizes thermal performance for continuous high-load operation.
Product Attributes
- Product Status: Last Time Buy
- Core Processor: SH-3 DSP
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 133MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: -20°C ~ 75°C (TA)
- Security Features: -
- Package / Case: 81-LFBGA
- Supplier Device Package: -
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