R8A77610DA01BGV#W9
Renesas Electronics America Inc
Product details
Engineered for next-generation automotive electronics, Renesas Electronics America Inc's R8A77610DA01BGV#W9 redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making R8A77610DA01BGV#W9 the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MPU architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the SH-4A, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.With 16KB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DDR include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive CANbus, I²C, SCI, SD, SSI, USB suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.Operating at 400MHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.The 449-BGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 449-BGA (21x21), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Obsolete
- Architecture: MPU
- Core Processor: SH-4A
- Flash Size: -
- RAM Size: 16KB
- Peripherals: DDR
- Connectivity: CANbus, I²C, SCI, SD, SSI, USB
- Speed: 400MHz
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: 449-BGA
- Supplier Device Package: 449-BGA (21x21)