R8A77860HBGV
Renesas Electronics America Inc
R8A77860HBGV
Renesas Electronics America Inc
IC MCU 32BIT SMD
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Product details
Renesas Electronics America Inc's R8A77860HBGV revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The SH-4A core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 2 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 533MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.High-bandwidth DDR3, SDRAM memory interfaces support the massive data flows characteristic of 5G signal processing.No graphics capabilities enable visualization of network performance metrics in real-time.IEEE 802.3u implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.USB 2.0 interfaces enable flexible configuration and debugging of network equipment during deployment.1.25V, 1.5V, 3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for -40°C ~ 85°C (TA) operation, the processor maintains performance in outdoor radio unit installations.The 593-BFBGA package design optimizes thermal performance for continuous high-load operation.Available in 593-HFBGA (25x25), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: SH-4A
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 533MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: IEEE 802.3u
- SATA: -
- USB: USB 2.0
- Voltage - I/O: 1.25V, 1.5V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 593-BFBGA
- Supplier Device Package: 593-HFBGA (25x25)
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