R9A07G044L24GBG#AC0
Renesas Electronics America Inc
Product details
Renesas Electronics America Inc's R9A07G044L24GBG#AC0 redefines power efficiency in the Embedded - Microprocessors segment, crafted for energy-harvesting IoT endpoints. This ultra-low-power microprocessor combines near-threshold voltage operation with intelligent power gating, achieving microampere-level standby currents for decade-long battery life in wireless sensor nodes.The ARM® Cortex®-A55 ultra-low-power core maintains full register retention at subthreshold voltages, enabling seamless operation from energy harvesting sources.Designed with 3 Core, 64-Bit configuration, the processor optimizes power distribution across multiple low-power domains.Operating at 1.2GHz in burst modes, the device balances performance and power consumption for intermittent computing applications.The ARM® Cortex®-M4, ARM® Mali-G31 sensor hub offloads signal processing tasks at microamp current levels.The DDR3L, DDR4 memory architecture implements state-retentive power gating for zero-leakage data preservation during sleep modes.No display controller operates with adaptive refresh rates to minimize power consumption in e-paper applications.MIPI/CSI, MIPI/DSI interfaces support direct connection to ultra-low-power displays common in wearable devices.10/100/1000Mbps (2) PHY includes energy-efficient Ethernet support for green networking applications.The USB 2.0 (2) interface implements low-power link states while maintaining instant wake-on-connect functionality.1.8V, 3.3V flexible I/O banks allow direct interfacing with energy harvesting circuits without level shifters.Specified for -40°C ~ 85°C (TA) operation, the processor maintains functionality in environmental monitoring applications.Power-optimized AES, RSA, SHA-1, SHA-224, SHA-256, TRNG include cryptographic accelerators with minimal energy overhead for secure IoT communications.The 551-BGA package minimizes thermal mass for rapid wake-up from deep sleep states.Offered in 551-BGA (21x21), the device supports thin-film battery integration in wearable designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A55
- Number of Cores/Bus Width: 3 Core, 64-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: ARM® Cortex®-M4, ARM® Mali-G31
- RAM Controllers: DDR3L, DDR4
- Graphics Acceleration: No
- Display & Interface Controllers: MIPI/CSI, MIPI/DSI
- Ethernet: 10/100/1000Mbps (2)
- SATA: -
- USB: USB 2.0 (2)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: AES, RSA, SHA-1, SHA-224, SHA-256, TRNG
- Package / Case: 551-BGA
- Supplier Device Package: 551-BGA (21x21)