R9A07G054L23GBG#AC0
Renesas Electronics America Inc
R9A07G054L23GBG#AC0
Renesas Electronics America Inc
SOC RZ/V2L 15MMBGA NON-SECUE DUA
Reference Price (USD)
1+
$32.85000
500+
$32.5215
1000+
$32.193
1500+
$31.8645
2000+
$31.536
2500+
$31.2075
Exquisite packaging
Discount
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R9A07G054L23GBG#AC0
$32.85
Product details
Renesas Electronics America Inc's R9A07G054L23GBG#AC0 revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The ARM® Cortex®-A55, ARM® Cortex®-M33 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 3 Core, 64-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 200MHz, 1.2GHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.The ARM® Mali-G31, Multimedia; NEON™ SIMD units accelerate OFDM processing and channel coding algorithms.High-bandwidth DDR3L, DDR4 memory interfaces support the massive data flows characteristic of 5G signal processing.Yes graphics capabilities enable visualization of network performance metrics in real-time.The LCD, MIPI/CSI, MIPI/DSI interfaces support remote management consoles for network equipment.10/100/1000Mbps (2) implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.USB 2.0 (2) interfaces enable flexible configuration and debugging of network equipment during deployment.1.8V, 3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for -40°C ~ 85°C (TA) operation, the processor maintains performance in outdoor radio unit installations.The 456-LFBGA package design optimizes thermal performance for continuous high-load operation.Available in 456-LFBGA (15x15), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
- Number of Cores/Bus Width: 3 Core, 64-Bit
- Speed: 200MHz, 1.2GHz
- Co-Processors/DSP: ARM® Mali-G31, Multimedia; NEON™ SIMD
- RAM Controllers: DDR3L, DDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD, MIPI/CSI, MIPI/DSI
- Ethernet: 10/100/1000Mbps (2)
- SATA: -
- USB: USB 2.0 (2)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 456-LFBGA
- Supplier Device Package: 456-LFBGA (15x15)
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