RAS-HS-C
Micro Connectors, Inc.
RAS-HS-C
Micro Connectors, Inc.
HEATSINK RASPBERRY PI ALUM/COP
Reference Price (USD)
1+
$8.25000
500+
$8.1675
1000+
$8.085
1500+
$8.0025
2000+
$7.92
2500+
$7.8375
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
RAS-HS-C
$8.25
Product details
The RAS-HS-C from Micro Connectors, Inc. sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.The Pressure-Sensitive Adhesive system allows for tool-less installation with consistent bond strength (3-5N/cm ). The adhesive maintains performance across -20 C to +85 C operating range.Micro-Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in ultra-thin airflow channels. The 0.3mm fin pitch creates optimal boundary layer disruption for maximum heat transfer.High-conductivity graphite laminate provides exceptional in-plane thermal conductivity (800 W/m K). The material is 40% lighter than equivalent aluminum solutions.
Product Attributes
- Product Status: Active
- Type: Top Mount Kit
- Package Cooled: Raspberry Pi 2B, 3B, 3B+, 4B, B+
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Rectangular, Fins; Square, Fins
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Aluminum, Copper
- Material Finish: -
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