RAS-HS50-KIT
Micro Connectors, Inc.
RAS-HS50-KIT
Micro Connectors, Inc.
HEATSINK RASPBERRY PI KIT 50PCS
Reference Price (USD)
1+
$14.75000
500+
$14.6025
1000+
$14.455
1500+
$14.3075
2000+
$14.16
2500+
$14.0125
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
RAS-HS50-KIT
$14.75
Product details
Optimized for automotive electronics, the RAS-HS50-KIT by Micro Connectors, Inc. sets new standards in Thermal - Heat Sinks reliability. This AEC-Q200 qualified thermal solution addresses unique challenges in electric vehicle power systems, combining robust construction with exceptional thermal performance.The Top Mount Skived design provides precise flatness ( 0.05mm/m ) required for automotive power modules. The manufacturing process eliminates internal stresses that could lead to micro-cracking in vibration environments.Specifically engineered for IGBT and TE0600 packages, the solution manages {Power Dissipation @ Temperature Rise} under hood temperatures reaching 125 C. The thermal interface maintains integrity across 1000+ thermal shock cycles (-40 C to +150 C).
Product Attributes
- Product Status: Active
- Type: Top Mount Kit
- Package Cooled: Development Boards, Raspberri Pi
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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