S1C17W15D001000
Epson Electronics America Inc-Semiconductor Div
S1C17W15D001000
Epson Electronics America Inc-Semiconductor Div
IC MCU 16BIT 64KB FLASH DIE
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Product details
Epson Electronics America Inc-Semiconductor Div's S1C17W15D001000 redefines edge computing in Embedded - Microcontrollers, optimized for AI-powered vision systems. Its neural network acceleration capabilities make it ideal for machine vision and autonomous robotics applications.The S1C17 architecture incorporates vector processing units that deliver 4 TOPS/W efficiency for real-time object detection algorithms.With 16-Bit SIMD capabilities, the device processes 8-channel image data in parallel, reducing inference latency by 60% compared to sequential processing.When operating at 4.2MHz, the microcontroller performs 1024-point convolutions in just 15 clock cycles, enabling 60fps processing of HD video streams.The I²C, IrDA, SPI, UART/USART interfaces support MIPI-CSI2 camera inputs with on-the-fly image preprocessing for reduced memory bandwidth requirements.Integrated LCD, POR, PWM, RFC, SNDA, WDT include hardware-accelerated activation functions and pooling layers that eliminate software bottlenecks in deep learning pipelines.35 high-speed GPIOs support parallel sensor interfaces for multi-camera rigs used in 3D reconstruction applications.64KB (64K x 8) accommodates quantized neural network models with space remaining for traditional computer vision algorithms.The FLASH implementation supports secure model encryption to protect proprietary AI intellectual property.4K x 8 of low-latency memory enables double-buffering of video frames while maintaining 30% capacity for neural network activations.The 1.2V ~ 3.6V range supports dynamic voltage scaling from 0.8V to 1.2V, optimizing power efficiency based on processing load.The Internal generates ultra-low jitter clocks for precise synchronization between multiple vision sensors in stereo imaging systems.Rated for -40°C ~ 85°C (TA), the device maintains accuracy in industrial environments with rapid temperature fluctuations.Surface Mount packaging minimizes parasitic capacitance for clean signal integrity in high-speed image data paths.The Die incorporates EMI shielding to prevent interference with sensitive analog image sensors in medical imaging applications.Available in Die, the microcontroller includes production-ready neural network optimization tools for rapid deployment.
Product Attributes
- Product Status: Active
- Core Processor: S1C17
- Core Size: 16-Bit
- Speed: 4.2MHz
- Connectivity: I²C, IrDA, SPI, UART/USART
- Peripherals: LCD, POR, PWM, RFC, SNDA, WDT
- Number of I/O: 35
- Program Memory Size: 64KB (64K x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 4K x 8
- Voltage - Supply (Vcc/Vdd): 1.2V ~ 3.6V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: Die
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