S70-138181045R
Harwin Inc.
S70-138181045R
Harwin Inc.
CONTACT SMD GOLD
Reference Price (USD)
1+
$0.51000
500+
$0.5049
1000+
$0.4998
1500+
$0.4947
2000+
$0.4896
2500+
$0.4845
Exquisite packaging
Discount
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S70-138181045R
$0.51
Product details
The S70-138181045R by Harwin Inc. redefines Contacts, Spring Loaded (Pogo Pins), and Pressure performance in high-speed computing applications, featuring {Mating Cycles} mating cycles with exceptional signal integrity. Engineered with {Contact Finish} plating at {Contact Finish Thickness}, these contacts deliver superior EMI shielding for server backplanes and data center equipment.Utilizing Contact Pad technology, these contacts maintain impedance control for high-speed differential pairs up to 56Gbps.The Surface Mount configuration enables high-density PCB layouts required in next-generation computing hardware.High-speed optimized Rectangular - 0.150" L x 0.071" W x 0.004" H (3.80mm x 1.80mm x 0.10mm) pad geometry minimizes parasitic capacitance in DDR5 memory interfaces.Advanced Beryllium Copper alloy provides the ideal combination of conductivity and thermal management.
Product Attributes
- Product Status: Active
- Contact Type: Contact Pad
- Mounting Type: Surface Mount
- Maximum Working Height: -
- Recommended Working Height: -
- Minimum Working Height: -
- Pad Layout Dimension: Rectangular - 0.150" L x 0.071" W x 0.004" H (3.80mm x 1.80mm x 0.10mm)
- Operating Force - Initial: -
- Operating Force - Mid Compression: -
- Plunger Size: -
- Features: -
- Mating Cycles: -
- Contact Material: Beryllium Copper
- Contact Finish: Gold
- Contact Finish Thickness: Flash
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