S70-332002045R
Harwin Inc.
S70-332002045R
Harwin Inc.
CONTACT SMD GOLD
Reference Price (USD)
1+
$0.63000
500+
$0.6237
1000+
$0.6174
1500+
$0.6111
2000+
$0.6048
2500+
$0.5985
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
S70-332002045R
$0.63
Product details
The S70-332002045R by Harwin Inc. redefines Contacts, Spring Loaded (Pogo Pins), and Pressure performance in high-speed computing applications, featuring {Mating Cycles} mating cycles with exceptional signal integrity. Engineered with {Contact Finish} plating at {Contact Finish Thickness}, these contacts deliver superior EMI shielding for server backplanes and data center equipment.Utilizing Contact Pad technology, these contacts maintain impedance control for high-speed differential pairs up to 56Gbps.The Surface Mount configuration enables high-density PCB layouts required in next-generation computing hardware.High-speed optimized Circular - 0.126" (3.20mm) Dia, 0.008" (0.20mm) H pad geometry minimizes parasitic capacitance in DDR5 memory interfaces.Advanced Beryllium Copper alloy provides the ideal combination of conductivity and thermal management.
Product Attributes
- Product Status: Active
- Contact Type: Contact Pad
- Mounting Type: Surface Mount
- Maximum Working Height: -
- Recommended Working Height: -
- Minimum Working Height: -
- Pad Layout Dimension: Circular - 0.126" (3.20mm) Dia, 0.008" (0.20mm) H
- Operating Force - Initial: -
- Operating Force - Mid Compression: -
- Plunger Size: -
- Features: -
- Mating Cycles: -
- Contact Material: Beryllium Copper
- Contact Finish: Gold
- Contact Finish Thickness: Flash
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