SAC57D53MCVLTR
NXP USA Inc.
SAC57D53MCVLTR
NXP USA Inc.
IC MCU 32BIT 3MB FLASH 208LQFP
Reference Price (USD)
1+
$50.93000
500+
$50.4207
1000+
$49.9114
1500+
$49.4021
2000+
$48.8928
2500+
$48.3835
Exquisite packaging
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SAC57D53MCVLTR
$50.93
Product details
Designed for industrial IoT applications, the SAC57D53MCVLTR by NXP USA Inc. redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.The ARM® Cortex®-A5/M4/M0+ core implements dynamic voltage scaling that reduces active power by 40% compared to fixed-voltage designs, extending battery life in remote monitoring nodes.A 32-Bit Tri-Core architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 80MHz, 160MHz, 320MHz with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.The CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI interfaces incorporate galvanic isolation support, enabling direct connection to industrial fieldbus networks without external isolation components.DMA, LCD, LVD/HVD, POR, PWM, WDT include advanced security features like cryptographic accelerators and true random number generators, protecting industrial equipment from cyber threats.3MB (3M x 8) accommodates both the application code and wireless stack, with 20% headroom for future feature expansion in modular industrial controllers.The FLASH implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.2.3M x 8 of retention RAM maintains context during deep sleep modes, enabling instant wake-up response to critical process events.The 3.15V ~ 5.5V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.Precision A/D 24x12b achieve 16-bit effective resolution through oversampling, enabling direct connection to RTD temperature sensors without external amplifiers.The Internal design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for -40°C ~ 105°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.Surface Mount packaging withstands repeated thermal shock from -40 C to 125 C, meeting reliability requirements for outdoor industrial installations.The 208-LQFP Exposed Pad format provides 8kV ESD protection on all pins, surviving electrostatic discharges common in plastic injection molding facilities.Available in 208-LQFP (28x28), the microcontroller supports industrial-grade qualification including 1000-hour HTOL testing at 125 C.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A5/M4/M0+
- Core Size: 32-Bit Tri-Core
- Speed: 80MHz, 160MHz, 320MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
- Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2.3M x 8
- Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 208-LQFP Exposed Pad
- Supplier Device Package: 208-LQFP (28x28)
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