SARLS-120X200MM

Sarnikon

General info

Part Number

SARLS-120X200MM

Manufacturer

Sarnikon

Description:

EXTRUDED HEATSINK 120MM X 200MM

Reference Price (USD)

$43.51600

500+

$43.08084

1000+

$42.64568

1500+

$42.21052

2000+

$41.77536

2500+

$41.3402

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

SARLS-120X200MM

$43.52

Product details

Sarnikon's SARLS-120X200MM delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 7.874" (200.00mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 4.724" (120.00mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.For cylindrical heat pipes, the 4.724" (120.00mm) OD variant offers 6mm and 8mm options. The design maintains capillary performance at 45 tilt angles common in rack-mounted servers.Precision 1.575" (40.00mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.