SEAMP-50-02.0-S-08
Samtec Inc.
SEAMP-50-02.0-S-08
Samtec Inc.
CONN HD ARRAY M 400POS PRESS-FIT
Reference Price (USD)
1+
$42.84000
500+
$42.4116
1000+
$41.9832
1500+
$41.5548
2000+
$41.1264
2500+
$40.698
Exquisite packaging
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SEAMP-50-02.0-S-08
$42.84
Product details
Samtec Inc.'s SEAMP-50-02.0-S-08 represents a quantum leap in Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) for millimeter-wave applications. This 60GHz+ rated connector solution enables next-generation radar systems and 5G mmWave infrastructure with unmatched signal integrity.The High Density Array, Male configuration features precision-machined contacts for waveguide transitions. The design maintains VSWR <1.2:1 up to 70GHz, outperforming conventional RF connectors.Available in 400 configurations, the connector supports phased array antenna elements. The optimized layout minimizes phase variation across channels.The /4 0.050" (1.27mm) spacing has been calculated for 60GHz operation. This precision spacing prevents unwanted coupling between adjacent antenna feeds.The 8 row architecture provides optimal ground return paths for millimeter-wave signals. This configuration has been validated for 64-element beamforming arrays.Engineered for Through Hole installation, the connector features kinematic mounting for precise alignment. The design compensates for PCB thermal expansion in outdoor deployments.The Gold formulation minimizes skin effect losses at millimeter-wave frequencies. Special surface treatments maintain consistent performance up to 100GHz.With 30.0µin (0.76µm) precision, the contacts achieve optimal RF performance. This control is essential for maintaining signal integrity in radar applications.The 7mm options accommodate various antenna panel configurations. The design minimizes signal path length variations in array systems.The 0.181" (4.60mm) profile has been optimized for integration with patch antenna arrays. This height provides proper impedance matching to radiating elements.
Product Attributes
- Product Status: Active
- Connector Type: High Density Array, Male
- Number of Positions: 400
- Pitch: 0.050" (1.27mm)
- Number of Rows: 8
- Mounting Type: Through Hole
- Features: -
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Mated Stacking Heights: 7mm
- Height Above Board: 0.181" (4.60mm)
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