SKV585811-CU
Wakefield-Vette
SKV585811-CU
Wakefield-Vette
COPPER HEATSINK 57.9X59X11MM
Reference Price (USD)
1+
$15.07000
500+
$14.9193
1000+
$14.7686
1500+
$14.6179
2000+
$14.4672
2500+
$14.3165
Exquisite packaging
Discount
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SKV585811-CU
$15.07
Product details
Wakefield-Vette's SKV585811-CU delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 2.323" (59.00mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 2.280" (57.91mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 0.433" (11.00mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).The 1.90°C/W @ 200 LFM performance is validated under ASHRAE TC9.9 Class A3 conditions. The design maintains stability at airflow rates from 10-25 CFM.The 7.70°C/W specification enables emergency operation during cooling system failures. The design maintains processors below 90 C for 15 minutes without airflow.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.
Product Attributes
- Product Status: Active
- Type: Top Mount, Skived
- Package Cooled: -
- Attachment Method: Push Pin
- Shape: Rectangular, Fins
- Length: 2.323" (59.00mm)
- Width: 2.280" (57.91mm)
- Diameter: -
- Fin Height: 0.433" (11.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 1.90°C/W @ 200 LFM
- Thermal Resistance @ Natural: 7.70°C/W
- Material: Copper
- Material Finish: -
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