SLB9665TT20FW560XUMA2
Infineon Technologies
SLB9665TT20FW560XUMA2
Infineon Technologies
SECURITY IC'S/AUTHENTICATION IC'
Reference Price (USD)
1+
$2.77180
500+
$2.744082
1000+
$2.716364
1500+
$2.688646
2000+
$2.660928
2500+
$2.63321
Exquisite packaging
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SLB9665TT20FW560XUMA2
$2.77
Product details
Infineon Technologies's SLB9665TT20FW560XUMA2 reimagines Embedded - Microcontrollers - Application Specific for smart grid and power conversion applications. This application-specific microcontroller integrates advanced PWM generation with high-resolution ADC capabilities, enabling precise control of power electronics.Optimized for Trusted Platform Module (TPM) implementations, the device features hardware-based overcurrent protection with 50ns response time. The integrated sigma-delta modulators enable direct sensorless motor control.The 16-Bit core includes dedicated trigonometric acceleration units. The parallel execution pipelines achieve 95% duty cycle accuracy at 100kHz switching frequencies.Supporting NVM (7.04kB) options, the flash memory incorporates shadow registers for bumpless firmware updates. The dual-plane architecture allows live updates during continuous operation.With LPC connectivity, the device supports EtherCAT POWERLINK protocols. Each communication peripheral includes reinforced isolation meeting IEC 61800-5-1 standards.The 1 configurable ports feature 12-bit DAC outputs for analog control. Programmable dead-time insertion prevents shoot-through in bridge configurations.Operating from 3V ~ 3.6V inputs, the power architecture withstands 100V transients. The integrated gate drivers support SiC and GaN power devices.Certified for -20°C ~ 85°C (TA) operation, the package uses direct-bonded copper substrates. Thermal impedance is minimized for high-current applications.The Surface Mount option supports press-fit assembly for high-power PCBs. The package design accommodates thick copper layers for heat dissipation.Available in 28-TSSOP (0.173", 4.40mm Width) format, the package includes Kelvin sense connections. The low-inductance design minimizes switching losses at high di/dt rates.Supplied in PG-TSSOP-28-2 configuration, each unit includes power cycling test reports. Production testing includes 100% burn-in at maximum junction temperature.
Product Attributes
- Product Status: Not For New Designs
- Applications: Trusted Platform Module (TPM)
- Core Processor: 16-Bit
- Program Memory Type: NVM (7.04kB)
- Controller Series: -
- RAM Size: -
- Interface: LPC
- Number of I/O: 1
- Voltage - Supply: 3V ~ 3.6V
- Operating Temperature: -20°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 28-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: PG-TSSOP-28-2
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