SLE66R04SNBZZZA1
Infineon Technologies
SLE66R04SNBZZZA1
Infineon Technologies
IC SECURITY CHIP CARD CTLR
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Product details
Infineon Technologies's SLE66R04SNBZZZA1 reimagines Embedded - Microcontrollers - Application Specific for smart grid and power conversion applications. This application-specific microcontroller integrates advanced PWM generation with high-resolution ADC capabilities, enabling precise control of power electronics.Optimized for Security implementations, the device features hardware-based overcurrent protection with 50ns response time. The integrated sigma-delta modulators enable direct sensorless motor control.The ARM® Cortex®-M4 core includes dedicated trigonometric acceleration units. The parallel execution pipelines achieve 95% duty cycle accuracy at 100kHz switching frequencies.Supporting EEPROM (512B) options, the flash memory incorporates shadow registers for bumpless firmware updates. The dual-plane architecture allows live updates during continuous operation.With ISO/IEC 14443 Type A connectivity, the device supports EtherCAT POWERLINK protocols. Each communication peripheral includes reinforced isolation meeting IEC 61800-5-1 standards.Certified for -25°C ~ 70°C (TA) operation, the package uses direct-bonded copper substrates. Thermal impedance is minimized for high-current applications.The Surface Mount option supports press-fit assembly for high-power PCBs. The package design accommodates thick copper layers for heat dissipation.Available in Die format, the package includes Kelvin sense connections. The low-inductance design minimizes switching losses at high di/dt rates.Supplied in Wafer configuration, each unit includes power cycling test reports. Production testing includes 100% burn-in at maximum junction temperature.
Product Attributes
- Product Status: Obsolete
- Applications: Security
- Core Processor: ARM® Cortex®-M4
- Program Memory Type: EEPROM (512B)
- Controller Series: -
- RAM Size: -
- Interface: ISO/IEC 14443 Type A
- Number of I/O: -
- Voltage - Supply: -
- Operating Temperature: -25°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: Wafer
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