SLE66R35RMCC8IXHSA1
Infineon Technologies
Product details
The SLE66R35RMCC8IXHSA1 from Infineon Technologies represents a cutting-edge solution in Embedded - Microcontrollers - Application Specific, engineered for mission-critical embedded systems. This application-specific microcontroller delivers unparalleled signal processing capabilities while maintaining strict power efficiency. With its advanced architecture, the device enables seamless system integration across industrial automation and 5G infrastructure applications.Optimized for Security, this microcontroller provides robust cryptographic acceleration and precise peripheral control. Whether implementing Trusted Platform Modules or automotive mirror control systems, its versatile architecture ensures reliable operation in harsh environments.The comprehensive ISO14443-3 Type A support facilitates seamless communication with sensors and actuators. Each interface channel implements galvanic isolation techniques to prevent ground loop interference in industrial settings.Rated for -25°C ~ 70°C operation, the device utilizes silicon-on-insulator technology to prevent thermal runaway. The package includes integrated heat spreaders for improved thermal dissipation.Available in Surface Mount configurations, the microcontroller supports both high-reliability soldering processes and prototyping-friendly installations. The lead-free package complies with IPC-7351B standards.The Die option features military-grade conformal coating compatibility. Package stress simulations ensure reliable operation under mechanical vibration up to 15G RMS.Delivered in Wafer format, the device includes moisture barrier packaging meeting MSL-3 requirements. Each unit undergoes automated optical inspection for solder joint integrity.
Product Attributes
- Product Status: Active
- Applications: Security
- Core Processor: -
- Program Memory Type: -
- Controller Series: -
- RAM Size: -
- Interface: ISO14443-3 Type A
- Number of I/O: -
- Voltage - Supply: -
- Operating Temperature: -25°C ~ 70°C
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: Wafer