SM3ZS067U410ABR1000
JAE Electronics
SM3ZS067U410ABR1000
JAE Electronics
CONN EDGE DUAL FMALE 67POS 0.020
Reference Price (USD)
1+
$1.63000
500+
$1.6137
1000+
$1.5974
1500+
$1.5811
2000+
$1.5648
2500+
$1.5485
Exquisite packaging
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SM3ZS067U410ABR1000
$1.63
Product details
JAE Electronics's SM3ZS067U410ABR1000 delivers military-grade reliability in Card Edge Connectors - Edgeboard Connectors for unmanned systems. Developed for harsh environment operation, this connector survives extreme shock, vibration, and environmental exposure.The M.2 (NGFF) Mini Card compatible design features hermetic sealing. When subjected to MIL-STD-810H Method 512.6 procedures, it prevents moisture ingress at 20psi differential pressure.Female configuration includes positive locking. The bayonet coupling requires 15N m torque for disengagement, preventing accidental separation in flight.The 67 contact arrangement supports triple-redundant systems. Each critical signal path has three parallel contacts for fault tolerance.Compatible with 0.031" (0.79mm) rigid-flex boards, the connector features floating contacts. This design accommodates 0.8mm board warpage without compromising connection quality.The 2 row architecture includes EMP shielding. The continuous Faraday cage provides 80dB attenuation from 10kHz to 18GHz.0.020" (0.50mm) micro-pitch withstands 100G shock pulses. Finite element analysis confirms zero contact separation during MIL-STD-883 Method 2002 testing.Dual capability supports battlefield diagnostics. The color-coded test points enable quick verification without specialized tools.The Board Guide package includes self-healing seals. The shape-memory polymer returns to original form after compression, maintaining seal integrity through repeated mating cycles.The Surface Mount, Right Angle version includes vibration-resistant features. The tuned mass dampers reduce resonant amplification by 12dB at critical frequencies.Solder process creates cold-welded joints. The diffusion-bonded connections exhibit no intermetallic growth after 1000 thermal cycles.The Copper Alloy contacts survive sand/dust exposure. Testing per MIL-STD-810G Method 510.6 shows <1m resistance change after 50 hours abrasion.Gold plating provides lubricity in vacuum. The dry-film coating maintains <0.2 friction coefficient from sea level to 10-6 torr.With 5.11µin (0.130µm) plating, the contacts resist atomic oxygen erosion. Testing on MISSE-7 confirms <5nm material loss after 18 months LEO exposure.Rated for -40°C ~ 80°C, the connector survives rapid thermal cycling. Testing confirms 500 cycles between -65 C and 150 C with no performance degradation.
Product Attributes
- Product Status: Active
- Card Type: M.2 (NGFF) Mini Card
- Gender: Female
- Number of Positions/Bay/Row: -
- Number of Positions: 67
- Card Thickness: 0.031" (0.79mm)
- Number of Rows: 2
- Pitch: 0.020" (0.50mm)
- Read Out: Dual
- Features: Board Guide
- Mounting Type: Surface Mount, Right Angle
- Termination: Solder
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 5.11µin (0.130µm)
- Contact Type: -
- Color: -
- Flange Feature: -
- Operating Temperature: -40°C ~ 80°C
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